United States
Sector
Keyword
Wire Bonding, Die Attach. Die bonding
Minimum Preferably 12th standard passed
Certified training for Die Bonding Operator (programme aligned to ELE/Q1701 released by Electronics Sector Skills Development Council)
Not applicable
The tasks a Wire Bonding Operator is expected to perform include:
Attaching the silicon die or micro-chip on a lead frame or PCB, respectively
Operating the automated pick-and-place machine to solder or paste the silicon die or chip on a lead frame or PCB
Proficient in operating the pick-and-place machine
Proficient in carrying out preventive maintenance of machine as per manufacturer?s schedule
Skilled at maintaining ESD, dust-free and 5S standards as per company?s policy
Knowledge of maintaining a safe and healthy working environment at the workplace
Proficient at handling hazardous material
Knowledge of electrostatic discharge (ESD) measures for electronic component safety
Knowledge of disposal of hazardous chemicals, tools and materials by following prescribed environmental norms Safety procedures while operating hazardous tools and equipment
Physically fit
Manual dexterity and stability
Ability to work independently
Hardworking and persistent
Self-motivated
Team player
Process oriented
Problem solving
It needs one to be on their toes
Work from home is not available
Part-time and contractual jobs may not be available
Local traveling is not a part of this job role
Need not handle a team
Working hours
Working is 9 hours everyday for 6 days a week
Shift system may be applicable
Is the job suitable for a candidate with special needs?Maybe
This job is not considered hazardous or dangerous
Health risks include physical and mental strain
One may develop occupational hazards like poor eyesight, lethargy, joint pain etc. if proper care is not taken
For freshers INR 7,000 to INR 9,000 per month For candidates with experience - INR 10,000 to INR 15,000 per month (These figures are indicative and subject to change)
EDSM Market in India
AlthoughIndiamajorly relies on imports of numerous electronics products, equipment and components from other countries, the country's Electronic System Design & Manufacturing (ESDM) market has witnessed a significant transformation over the past few years.
Future Prospects
While India?s presence as a base for manufacture of high end components is still underway, by nature of its growth in the IT/ITES industry, India has already established a presence in the R&D for components with global electronics majors such as Texas Instruments, Intel and others having their research facilities in India.
Projected HR Requirement in Electronics Components
According to the IMaCS Analysis, the human resource requirement in the Electronics Components segment has been projected to grow from 1,49,000 in 2008 to 8,34,000 in 2022 that is an increment of 6,85, 000 resources.
The Electronics Sector Skills Council of India has listed Active Components as one of the top 14 sub-sectors with a high potential for employment.
Manufacturing companies
Packaging solutions companies
Job openings are in Tier I, Tier II and Tier III cities
Technical institutes across India
ITIs across India